Applied after final test, it can detect appearance defects in encapsulated devices by patented 2D/3D vision inspection system.
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Project |
Content |
|
Product Type |
LGA、QFN、BGA、QFP、SOP |
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2D Inspection |
Cracks, adhesive residue, damage, abnormal solder balls, foreign objects, positional accuracy of solder balls |
|
3D Inspection |
BGA height, coplanarity, etc |
|
Tray and transmission method |
JEDEC standard tray |
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Product Size |
3mmX3mm-120mmX120mm |
|
Support Incoming Materials |
Tray to Tray&Tray to Reel |
|
2D Visual System |
25MP |
|
Pixel Resolution |
10μm/pixel |
|
Optional and customized |
5S/3D/Reel modules |