FUNCTIONAL PURPOSE
• OCR/BC comparison (wafer/frame)
• Mounting verification on frame
- wafer centricity
- wafer rotation
- wafer dimensions
• Optional wafermapping functions
- wafermap creation
- controlmap creation
TECHNICAL SPECIFICATION
General
-Designed for cleanroom class ISO 5 (100) or lower
-Automatic frame handling (plastic/metal)
-Two frame sizes (6“ 8“ wafers or 8“ 12“ wafers)
-Customer specific wafer cassette ports
-OCR reader for wafer top
-BC reader for frame top
-Inspection camera with telecentric lens
-Gantry XY axis system
OCR/BC correlation
-Reading of OCR wafer code on diced/bare wafer 0-365°
-Reading of BC frame code on frame/bluetape 0-365°
-Correlation match between OCR and BC string
Mounting verification
-Wafer position centricity [mm] in relation to frame center
-Wafer rotation [°] in relation to frame flat
-Wafer size [mm] in X and Y direction
Wafermapping function (Option)
-Chip size measurement
-Control map creation
-Inked wafer inspection with map file creation
Motorized XY table
-Repetition accuracy: < 1 μm
-Accuracy: 1 μm (Resolution 0,05 μm)
-Orthogonality: < 2 arc sec
-Max. movement speed: 240 mm/s, with 4 mm spindle pitch