STP 2005
Brand: Muegge
Plasma Decapsulation Tool Microwave Plasma System with integrated Remote Plasma Source
- Efficient removal of packaging and mold/epoxy in particular
- High selectivity towards passivation layers like SiO2 and Si3N4
- No attack on bonding wires made of Cu, Au, Al, Pd and even Ag
- Low thermal load on microchip
- Fast, isotropic etching by radicals only
- No ions, no microwave radiation, no electrical fields in the area of the samples
- Very low thermal impact only by chemical reaction energy due to the effect of the
radicals - Very high removal efficiency (>200μm/h) including inorganic filler materals
- Only slight etching of chip passivation (high selectivity > 500:1)
- Short decapsulation times: typically 1-3 hours after laser ablation
- High environmental compliance due to nearly complete dissociation