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cyberTECHNOLOGIES for Semiconductor Application

Application: Semiconductor & Electronics


High-resolution, non-contact 3D measurement system options to the microelectronics


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CYBERTECHNOLOGIES CT300 - VIEW PRODUCT

 TTV  

 

Surface of a silicone wafer

  • Accurate flatness measurement over large areas
  • Colors can be set to specification limits

 Coplanarity

Surface image of a Micro BGA

  • Measure max. height, diameter and position of each bump
  • Regression and seating plane coplanarity

 Flatness

 

Countour map of an electronic component

  • Advanced etch removing and modifiying algorithms
  • Use polygon shape cursors to mark region of interest