Wafer Fabrication to Backend Packaging
Interfacial characterization of Ultra-Thin Films, Transparent FIlms and Thick Fim
Metals, Ceramics, Polymers and Composites
Structural & Cell Biology , Pharmaceuticals, Medical Implants & Devices, Biomimetics, and Pathology
Various General Industry Application
Sample Preparation for SEM
If you need to create a 3D CAD model from actual object just contact us and we will do it all for you. Our engineers will support you in reverse engineering process.
Professional 3D scanning services for the needs of different industries. The 3D scanning process is conduct on professional 3D scanners.
Back end Testing for Packaged Devices
Phenom XL provides 100 x 100mm stage with flexibility to inspect wire bond with EDS in either QC, R&D , Production or Failure Analysis
Laser Dicing Depth and Width Auto Measurement
CT of Dental Implants and Prostheses
High-resolution, non-contact 3D measurement system options to the microelectronics
Transparent Films and Coatings
Dental Tooth Surface Matching
Solar Cell, MEMS, Corrosion Analysis, Metal Grain Structure etc
Non Destructive Acoustic Imaging Analysis for Life Science
Non destructive inspection of delamination or void
Industrial endoscopes from IT Concepts are used in energy generation, aviation and aerospace, as well as in the automotive industry, building engineering and security and police sector.
High Speed Imaging of Wire Bond Process
Metallography, Metallurgical Testing, Microstructural Analysis