Phenom XL for Wire Bond and Whisker Inspection
Application: Semiconductor & Electronics
Phenom XL provides 100 x 100mm stage with flexibility to inspect wire bond with EDS in either QC, R&D , Production or Failure Analysis
Technology never rests. Consumer demand is driving the electronic market to produce more efficiently while features are even shrinking. Electronics manufacturers have to find the right balance between performance and time-to-market for their devices, components and packaging materials. Scanning electron microscopes are often used in these manufacturer's research or quality control departments.
Wire Bond Defects such as Broken Wire, Chipped Die, Cracked Die and Nicked Wire.