PVA TEPLA SAM for Semiconductor Application

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PVA TEPLA SAM for Semiconductor Application

Application: Semiconductor & Electronics


Non destructive inspection of delamination or void


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PVA TEPLA SAM 302 - VIEW PRODUCT

The possibility of mapping the structure of every sample in a non-destructive manner to detect their structure and connection errors makes our systems important aids in all production processes—not just in the field of semiconductor technology. The areas of application are diverse and range from the front end to the back end.

 Our systems enable you to check:

  • Wafers and bonded wafers
  • SiC ingots and wafers
  • Si ingots
  • MEMS
  • Die structures
  • Stach dies
  • Microprocessors
  • LED Technology
  • Flip Chips
  • Power electronics
  • Bonded Interfaces
  • CMOS Image Sensors
  • Molded Components
  • Passive Components (Resistors, Capacitors)
  • Packaging