Applications

Wafer Fabrication to Backend Packaging

Interfacial characterization of Ultra-Thin Films, Transparent FIlms and Thick Fim

Metals, Ceramics, Polymers and Composites

Structural & Cell Biology , Pharmaceuticals, Medical Implants & Devices, Biomimetics, and Pathology

Various General Industry Application

Sample Preparation for SEM

  • Applications
  • Semiconductor & Electronics

Nikon XTV160 for Electronics Application

Telecom & Electronics, MEMS, Automated measurement, Optoelectronics, Microelectronics, X-ray inspection of BGA, wirebonds, MEMS, loaded PCB, Mobile phones


  • Applications
  • Semiconductor & Electronics

Phenom XL for Wire Bond and Whisker Inspection

Phenom XL provides 100 x 100mm stage with flexibility to inspect wire bond with EDS in either QC, R&D , Production or Failure Analysis


  • Applications
  • Semiconductor & Electronics

cyberTECH for Wafer Laser Groove Depth and Width Auto Measurement

Laser Dicing Depth and Width Auto Measurement


  • Applications
  • Semiconductor & Electronics

cyberTECHNOLOGIES for Semiconductor Application

High-resolution, non-contact 3D measurement system options to the microelectronics


  • Applications
  • Semiconductor & Electronics

PVA TEPLA SAM for Semiconductor Application

Non destructive inspection of delamination or void


  • Applications
  • Semiconductor & Electronics

DITECT for Semiconductor Application

High Speed Imaging of Wire Bond Process