EBIS Wafer Backside Optical Inspection

YOUR BENEFITS

- Semi-automatic macroscopic defect detection on wafer backside

- Visualization of complete wafer backside on the screen

- Transparent wafer frontside overlay during backside defect marking

- Automatic wafermap edit when backside defect is marked

- Fast automatic loading and scanning process (up to 250 wph)

TECHNICAL COMPONENTS

- SPA ULA200 Autoloader

- CIS High Resolution Image Sensor with movement axis

- Dome Light Illumination

- Frontside Camera for Alignment and Referencing

TECHNICAL SPECIFICATIONS

- Wafer diameter up to 200mm (300mm on request)

- Thin and Taiko wafer on request

- Backside scan resolution down to 21um/px

- Optional SECS/GEM Compatible Interface

- Various adaptable wafermapping formats