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EBIS Wafer Backside Optical Inspection

Brand: PVA TePla SPA

Semi-automatic Wafer Backside Inspection System

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- Semi-automatic macroscopic defect detection on wafer backside

- Visualization of complete wafer backside on the screen

- Transparent wafer frontside overlay during backside defect marking

- Automatic wafermap edit when backside defect is marked

- Fast automatic loading and scanning process (up to 250 wph)


- SPA ULA200 Autoloader

- CIS High Resolution Image Sensor with movement axis

- Dome Light Illumination

- Frontside Camera for Alignment and Referencing


- Wafer diameter up to 200mm (300mm on request)

- Thin and Taiko wafer on request

- Backside scan resolution down to 21um/px

- Optional SECS/GEM Compatible Interface

- Various adaptable wafermapping formats