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PIA Probe Inspection Addon

Brand: PVA TePla SPA


A multi functional compact docking unit for existing probers


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STANDARD APPLICATIONS: 

1. PIA Ink : Inking Defective dies with 100% Inkdot Inspection

2. PIA AOI: Automatic Optical Inspection

3. PIA Tabletop: Standalone tabletop system (Ink or AOI Application)

YOUR BENEFITS

- 100% Inkdot quality control

- Ink splash detection on good dies

- Automatic reinking of inkdot failures

- Wafer specific RGB LED Illumination Settings

- Archiving image of completely inked wafer

- Optional SECS/GEM Compatible interface

TECHNICAL CRITERIAS

- Inkdot size (min/max)

- Inkdot position

- Inkdot shape (Roundness, aspect ratio)

- Ink on pass chip detection

- Individual inspection parameters for edge dies and active area 

TECHNICAL COMPONENTS

- 2 Telecentric inspection cameras

- Automatic camera changer

- RGB Illumination

- Inking equipment (Pneumatic or electric)

- Automatic needle tip measurement

- Camera for needle tip visualization

- Door Lock

TECHNICAL SPECIFICATIONS

- Wafer diameter up to 300mm

- Chip size down to 200um

- Ink splash detection down to 30um

- Framed wafers (with automatic expansion compensation)

FOR PROBER VERSION

- Control of prober via GPIB protocol

- PIA replaces prober headplate

- Weight incl. PIA-headplate ~ 80kg

- Headplates 600mm, 640mm, 680mm or customized

- Automatic headplate-hole opening/closing

- Motorized PIA Tliting System